Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9478500 | Interposer substrate, semiconductor structure and fabricating process thereof | Chin-Li KAO, Hung-Jen Chang, Tang-Yuan Chen, Wei-Hong LAI | 2016-10-25 | $6,100,000 |
| 9437565 | Semiconductor substrate and semiconductor package structure having the same | Guo-Cheng Liao, Yi Ding | 2016-09-06 | |
| 9420506 | Method and apparatus to facilitate influencing handover decisions | James Snider | 2016-08-16 | |
| 9349611 | Stackable semiconductor package and manufacturing method thereof | Yi Ding | 2016-05-24 | $6,583,000 |