Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9478500 | Interposer substrate, semiconductor structure and fabricating process thereof | Chia-Ching Chen, Chin-Li KAO, Tang-Yuan Chen, Wei-Hong LAI | 2016-10-25 | $6,100,000 |