Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989343 | Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2011-08-02 |
| 7948771 | Electrical component and method for making the same | Hong-Bo Zhang, Chao-Dong Huang | 2011-05-24 |