Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058718 | Package substrate embedded with semiconductor component | Shih-Ping Hsu | 2011-11-15 |
| 8058723 | Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof | — | 2011-11-15 |
| 8035127 | Packaging substrate structure with a semiconductor chip embedded therein | Shang-Wei Chen | 2011-10-11 |
| 7973397 | Package substrate having embedded semiconductor chip and fabrication method thereof | Shin-Ping Hsu | 2011-07-05 |
| 7969745 | Circuit board structure having electronic components integrated therein | Shih-Ping Hsu | 2011-06-28 |
| 7902676 | Stacked semiconductor device and fabricating method thereof | — | 2011-03-08 |