Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7973397 | Package substrate having embedded semiconductor chip and fabrication method thereof | Kan-Jung Chia | 2011-07-05 |
| 7908744 | Method for fabricating printed circuit board having capacitance components | Chih-Kui Yang | 2011-03-22 |