Issued Patents 2011
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8070932 | Circuit board with identifiable information and method for fabricating the same | Shang-Wei Chen, Suo-Hsia Tang, Chao-Wen Shih | 2011-12-06 |
| 8058721 | Package structure | — | 2011-11-15 |
| 8058718 | Package substrate embedded with semiconductor component | Kan-Jung Chia | 2011-11-15 |
| 8058566 | Packaging substrate structure and manufacturing method thereof | — | 2011-11-15 |
| 8058105 | Method of fabricating a packaging structure | — | 2011-11-15 |
| 8022513 | Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same | — | 2011-09-20 |
| 8017442 | Method of fabricating a package structure | — | 2011-09-13 |
| 7973398 | Embedded chip package structure with chip support protruding section | — | 2011-07-05 |
| 7969745 | Circuit board structure having electronic components integrated therein | Kan-Jung Chia | 2011-06-28 |
| 7956472 | Packaging substrate having electrical connection structure and method for fabricating the same | — | 2011-06-07 |
| 7906850 | Structure of circuit board and method for fabricating same | Shing-Ru Wang, Hsien-Shou Wang | 2011-03-15 |
| 7881070 | Circuit board having power source | — | 2011-02-01 |
| 7863729 | Circuit board structure embedded with semiconductor chips | Chung-Cheng Lien, Shang-Wei Chen | 2011-01-04 |