Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7906850 | Structure of circuit board and method for fabricating same | Shing-Ru Wang, Shih-Ping Hsu | 2011-03-15 |
| 7867888 | Flip-chip package substrate and a method for fabricating the same | — | 2011-01-11 |