HY

Hsiao-Wei Yeh

TSMC: 2 patents #147 of 830Top 20%
Overall (2011): #95,603 of 364,097Top 30%
2
Patents 2011

Issued Patents 2011

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8039195 Si device making method by using a novel material for packing and unpacking process Jen-Chieh Shih 2011-10-18
8029969 Material and method for photolithography Jen-Chieh Shih, Jian-Hong Chen 2011-10-04