Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8037918 | Pick-up heads and systems for die bonding and related applications | Ya Ping Wang, Jian Yang, Chee Keong Chin | 2011-10-18 |
| 7989941 | Integrated circuit package system with support structure for die overhang | Chee Keong Chin, Ya Ping Wang | 2011-08-02 |