Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8037918 | Pick-up heads and systems for die bonding and related applications | Jian Yang, Guo Qiang Shen, Chee Keong Chin | 2011-10-18 |
| 8035336 | Charger slipcover and handheld device | Yi-Feng Sun, Shih-Kuang Tsai | 2011-10-11 |
| 7989941 | Integrated circuit package system with support structure for die overhang | Chee Keong Chin, Guo Qiang Shen | 2011-08-02 |