Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8037918 | Pick-up heads and systems for die bonding and related applications | Ya Ping Wang, Jian Yang, Guo Qiang Shen | 2011-10-18 |
| 7989941 | Integrated circuit package system with support structure for die overhang | Guo Qiang Shen, Ya Ping Wang | 2011-08-02 |
| 7867821 | Integrated circuit package system with through semiconductor vias and method of manufacture thereof | — | 2011-01-11 |