Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071431 | Overmolded semiconductor package with a wirebond cage for EMI shielding | Dinphuoc V. Hoang, Anil Agarwal, Robert W. Warren, Matthew Sean Read, Anthony James LoBianco | 2011-12-06 |
| 8058714 | Overmolded semiconductor package with an integrated antenna | Gye-An Lee | 2011-11-15 |