Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071431 | Overmolded semiconductor package with a wirebond cage for EMI shielding | Dinphuoc V. Hoang, Thomas E. Noll, Anil Agarwal, Robert W. Warren, Matthew Sean Read | 2011-12-06 |