Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071431 | Overmolded semiconductor package with a wirebond cage for EMI shielding | Dinphuoc V. Hoang, Thomas E. Noll, Anil Agarwal, Matthew Sean Read, Anthony James LoBianco | 2011-12-06 |
| 8022490 | Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds | — | 2011-09-20 |
| 8024490 | Method and system for generic data transfer interface | — | 2011-09-20 |
| 8013440 | Enhanced thermal dissipation ball grid array package | — | 2011-09-06 |
| 7923842 | GaAs integrated circuit device and method of attaching same | Hong Shen, Ravi Ramanathan, Qiuliang Luo, Usama K Abdali | 2011-04-12 |