Issued Patents 2011
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080122 | Method of manufacturing wiring substrate and method of manufacturing semiconductor device | Kei Murayama, Mitsutoshi Higashi, Hideaki Sakaguchi | 2011-12-20 |
| 8062927 | Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same | Kiyoshi Ol | 2011-11-22 |
| 8053886 | Semiconductor package and manufacturing method thereof | Yuichi Taguchi, Mitsutoshi Higashi, Akinori Shiraishi, Hideaki Sakaguchi | 2011-11-08 |
| 8044429 | Light-emitting device and method for manufacturing the same | Mitsutoshi Higashi, Yuichi Taguchi, Akinori Shiraishi, Kei Murayama, Naoyuki Koizumi +1 more | 2011-10-25 |
| 8008120 | Method for producing electronic part package | Hideaki Sakaguchi, Mitsutoshi Higashi | 2011-08-30 |
| 8003895 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Hiroyuki Kato, Syoji Watanabe | 2011-08-23 |
| 7989927 | Silicon substrate for package | Akinori Shiraishi, Kei Murayama, Yuichi Taguchi, Mitsutoshi Higashi | 2011-08-02 |
| 7981798 | Method of manufacturing substrate | Yuichi Taguchi, Akinori Shiraishi, Kei Murayama, Hideaki Sakaguchi, Mitsutoshi Higashi | 2011-07-19 |
| 7964950 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Toshinori Koyama, Kazutaka Kobayashi, Mitsutoshi Higashi | 2011-06-21 |
| 7960820 | Semiconductor package | Akinori Shiraishi, Kei Murayama, Yuichi Taguchi, Mitsutoshi Higashi | 2011-06-14 |
| 7952191 | Semiconductor device | Mitsutoshi Higashi | 2011-05-31 |
| 7948092 | Electronic component and method for manufacturing the same | Kei Murayama, Yuichi Taguchi, Akinori Shiraishi, Mitsutoshi Higashi | 2011-05-24 |
| 7897510 | Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same | Kei Murayama, Akinori Shiraishi, Yuichi Taguchi, Naoyuki Koizumi, Mitsutoshi Higashi | 2011-03-01 |
| 7897432 | Method for producing electronic part package | Hideaki Sakaguchi, Mitsutoshi Higashi | 2011-03-01 |
| 7893524 | Wiring substrate and semiconductor device and method of manufacturing the same | Yoshihiro Machida | 2011-02-22 |
| 7894201 | Electronic component and method for manufacturing the same | Kei Murayama, Yuichi Taguchi, Akinori Shiraishi, Mitsutoshi Higashi | 2011-02-22 |
| 7888953 | Probe card | Yuichi Taguchi, Akinori Shiraishi, Kei Murayama, Hideaki Sakaguchi | 2011-02-15 |
| 7882626 | Method of manufacturing wiring board having a semiconductor thereon | Kei Murayama, Mitsutoshi Higashi | 2011-02-08 |
| 7884484 | Wiring board and method of manufacturing the same | Takaharu Yamano, Hajime Iizuka, Tetsuya Koyama | 2011-02-08 |
| 7876036 | Light emitting apparatus and manufacturing method therefor | Yuichi Taguchi, Hideaki Sakaguchi, Akinori Shiraishi, Naoyuki Koizumi, Kei Murayama +1 more | 2011-01-25 |