Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062571 | Resin sealing method in stacked wiring substrate | — | 2011-11-22 |
| 7994431 | Substrate with built-in electronic component and method for manufacturing the same | Takaharu Yamano | 2011-08-09 |
| 7936061 | Semiconductor device and method of manufacturing the same | — | 2011-05-03 |
| 7923367 | Multilayer wiring substrate mounted with electronic component and method for manufacturing the same | — | 2011-04-12 |
| 7906833 | Semiconductor device and manufacturing method thereof | Takaharu Yamano | 2011-03-15 |
| 7893524 | Wiring substrate and semiconductor device and method of manufacturing the same | Masahiro Sunohara | 2011-02-22 |
| 7882627 | Method of manufacturing a multilayer wiring board | Tetsuya Koyama, Tsuyoshi Kobayashi, Hiroyuki Kato | 2011-02-08 |