Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035033 | Wiring substrate with plurality of wiring and insulating layers with a solder resist layer covering a wiring layer on the outside of outer insulating layer but exposing the holes in the outer insulating layer | — | 2011-10-11 |
| 8035264 | Motor | — | 2011-10-11 |
| 7964950 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Kei Murayama, Toshinori Koyama, Mitsutoshi Higashi | 2011-06-21 |