Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084335 | Method of thinning a semiconductor wafer using a film frame | Michael J. Seddon | 2011-12-27 |
| 7944044 | Semiconductor package structure having enhanced thermal dissipation characteristics | Michael J. Seddon | 2011-05-17 |
| 7875964 | Multi-chip semiconductor connector and method | Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2011-01-25 |