Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084335 | Method of thinning a semiconductor wafer using a film frame | Francis J. Carney | 2011-12-27 |
| 8012857 | Semiconductor die singulation method | Gordon M. Grivna | 2011-09-06 |
| 7989319 | Semiconductor die singulation method | Gordon M. Grivna | 2011-08-02 |
| 7944044 | Semiconductor package structure having enhanced thermal dissipation characteristics | Francis J. Carney | 2011-05-17 |