Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7901990 | Method of forming a molded array package device having an exposed tab and structure | James P. Letterman, Jr., Kent L. Kime | 2011-03-08 |
| 7875964 | Multi-chip semiconductor connector and method | Francis J. Carney, Phillip Celaya, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2011-01-25 |