Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7880179 | Process for making contact with and housing integrated circuits | Dipl.-Ing. Florian Bieck | 2011-02-01 |
| 7863200 | Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules | Dietrich Mund | 2011-01-04 |