DB

Dipl.-Ing. Florian Bieck

WP Wafer-Level Packaging Portfolio: 1 patents #1 of 4Top 25%
Overall (2011): #316,058 of 364,097Top 90%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7880179 Process for making contact with and housing integrated circuits Jürgen Leib 2011-02-01