Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863200 | Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules | Jürgen Leib | 2011-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863200 | Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules | Jürgen Leib | 2011-01-04 |