Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053868 | Wafer level chip scale package of image sensor and manufacturing method thereof | Jin Mun Ryu, Hyung Kyu Park | 2011-11-08 |
| 8001451 | Trellis encoder and trellis encoding device having the same | Eui-jun Park, Seok Hyun Yoon, Kyo-shin Choo, Keon-yong Seok | 2011-08-16 |
| 7964945 | Glass cap molding package, manufacturing method thereof and camera module | Jin Mun Ryu, Jung Seok Lee, Hyung Kyu Park, Bo Kyoung Kim, Yun Seok Woo | 2011-06-21 |