Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053868 | Wafer level chip scale package of image sensor and manufacturing method thereof | Jung Jin Kim, Hyung Kyu Park | 2011-11-08 |
| 7964945 | Glass cap molding package, manufacturing method thereof and camera module | Jung Seok Lee, Hyung Kyu Park, Bo Kyoung Kim, Yun Seok Woo, Jung Jin Kim | 2011-06-21 |
| 7925154 | Camera module and method of manufacturing the same | — | 2011-04-12 |