Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053868 | Wafer level chip scale package of image sensor and manufacturing method thereof | Jin Mun Ryu, Jung Jin Kim | 2011-11-08 |
| 7964945 | Glass cap molding package, manufacturing method thereof and camera module | Jin Mun Ryu, Jung Seok Lee, Bo Kyoung Kim, Yun Seok Woo, Jung Jin Kim | 2011-06-21 |