Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026166 | Interconnect structures comprising capping layers with low dielectric constants and methods of making the same | Griselda Bonilla, Tien-Jen Cheng, Lawrence A. Clevenger, Stephan Grunow, Chao-Kun Hu +5 more | 2011-09-27 |