Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030576 | Wired circuit board with interposed metal thin film and producing method thereof | Katsutoshi Kamei, Visit Thaveeprungsriporn | 2011-10-04 |
| 7908965 | Underlay substrate for printing a printed circuit on a substrate | — | 2011-03-22 |
| 7872200 | Wired circuit board and connection structure between wired circuit boards | Toshiki Naito, Yasunari Ooyabu | 2011-01-18 |