Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030576 | Wired circuit board with interposed metal thin film and producing method thereof | Katsutoshi Kamei, Takahiko Yokai | 2011-10-04 |
| 7985926 | Printed circuit board and electronic component device | Kensuke Nishi, Akinori Itokawa | 2011-07-26 |
| 7974508 | Multi-layer structure and method for manufacturing the same | Ieng Kin Lao | 2011-07-05 |