Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071886 | Wired circuit board having a semiconductive grounding layer and producing method thereof | Jun Ishii, Yasuhito Funada | 2011-12-06 |
| 8063312 | Wired circuit board and producing method thereof | Jun Ishii, Kensuke Nishi | 2011-11-22 |
| 8053674 | Wired circuit board | Jun Ishii, Naohiro Terada | 2011-11-08 |
| 8015703 | Method of manufacturing a wired circuit board | Hitoki Kanagawa, Tetsuya Ohsawa | 2011-09-13 |
| 7872200 | Wired circuit board and connection structure between wired circuit boards | Takahiko Yokai, Toshiki Naito | 2011-01-18 |