Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076770 | Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion | Yutaka Kagaya, Hajime Takasaki | 2011-12-13 |
| 7993975 | Method of manufacturing semiconductor device including mounting and dicing chips | Mitsuhisa Watanabe | 2011-08-09 |
| 7928551 | Semiconductor device and method of manufacturing the same | Reiko Fujiwara, Akihiko Hatasawa | 2011-04-19 |
| 7888179 | Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof | Yutaka Kagaya | 2011-02-15 |