Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076770 | Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion | Yutaka Kagaya, Fumitomo Watanabe | 2011-12-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076770 | Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion | Yutaka Kagaya, Fumitomo Watanabe | 2011-12-13 |