Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076770 | Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion | Fumitomo Watanabe, Hajime Takasaki | 2011-12-13 |
| 7935576 | Semiconductor device and manufacturing method of the same | Hidehiro Takeshima | 2011-05-03 |
| 7888179 | Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof | Fumitomo Watanabe | 2011-02-15 |