Issued Patents 2011
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7915161 | Post passivation interconnection schemes on top of IC chip | Mou-Shiung Lin | 2011-03-29 |
| 7915734 | Chip structure and process for forming the same | Mou-Shiung Lin, Ching-Cheng Huang | 2011-03-29 |
| 7915157 | Chip structure and process for forming the same | Mou-Shiung Lin, Ching-Cheng Huang | 2011-03-29 |
| 7906849 | Chip structure and process for forming the same | Mou-Shiung Lin, Ching-Cheng Huang | 2011-03-15 |
| 7906422 | Chip structure and process for forming the same | Mou-Shiung Lin, Ching-Cheng Huang | 2011-03-15 |
| 7902067 | Post passivation interconnection schemes on top of the IC chips | Mou-Shiung Lin | 2011-03-08 |
| 7898058 | Integrated chip package structure using organic substrate and method of manufacturing the same | Mou-Shiung Lin, Ching-Cheng Huang | 2011-03-01 |
| 7892965 | Post passivation interconnection schemes on top of IC chip | Mou-Shiung Lin | 2011-02-22 |
| 7863739 | Low fabrication cost, fine pitch and high reliability solder bump | Mou-Shiung Lin, Ching-Cheng Huang | 2011-01-04 |