Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8064224 | Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same | Sandeep B. Sane | 2011-11-22 |
| 7882624 | Method of forming electronic package having fluid-conducting channel | Chuan Hu | 2011-02-08 |