Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8064224 | Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same | Ravi Mahajan | 2011-11-22 |
| 7901982 | Modified chip attach process | Biju Chandran | 2011-03-08 |