Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080870 | Die-warpage compensation structures for thinned-die devices, and methods of assembling same | — | 2011-12-20 |
| 7888183 | Thinned die integrated circuit package | Cheng-Yi Liu, Johanna M. Swan, Steven Towle | 2011-02-15 |
| 7882624 | Method of forming electronic package having fluid-conducting channel | Ravi Mahajan | 2011-02-08 |