Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955885 | Methods of forming packaged micro-electromechanical devices | Harmeet Bhugra, Ye Wang | 2011-06-07 |
| 7871857 | Methods of forming multi-chip semiconductor substrates | Harmeet Bhugra | 2011-01-18 |