Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955885 | Methods of forming packaged micro-electromechanical devices | Kuolung Lei, Ye Wang | 2011-06-07 |
| 7939990 | Thin-film bulk acoustic resonators having perforated bodies that provide reduced susceptibility to process-induced lateral dimension variations | Ye Wang | 2011-05-10 |
| 7871857 | Methods of forming multi-chip semiconductor substrates | Kuolung Lei | 2011-01-18 |