Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960208 | Wafer level hermetic bond using metal alloy with raised feature | Gregory A. Carlson, David M. Erlach, Alok Paranjpye | 2011-06-14 |
| 7872432 | MEMS thermal device with slideably engaged tether and method of manufacture | Alok Paranjpye | 2011-01-18 |