Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960208 | Wafer level hermetic bond using metal alloy with raised feature | Gregory A. Carlson, Alok Paranjpye, Jeffery F. Summers | 2011-06-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960208 | Wafer level hermetic bond using metal alloy with raised feature | Gregory A. Carlson, Alok Paranjpye, Jeffery F. Summers | 2011-06-14 |