EL

Eric H. Laine

IBM: 1 patents #3,726 of 9,568Top 40%
📍 Binghamton, NY: #13 of 25 inventorsTop 55%
🗺 New York: #3,659 of 10,473 inventorsTop 35%
Overall (2011): #307,671 of 364,097Top 85%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7932169 Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more 2011-04-26