Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030579 | Multilayer printed wiring board | Yoichiro Kawamura, Tomoyuki Ikeda | 2011-10-04 |
| 8030577 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2011-10-04 |
| 8020291 | Method of manufacturing a printed wiring board | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2011-09-20 |
| 8018045 | Printed circuit board | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2011-09-13 |
| 8006377 | Method for producing a printed wiring board | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2011-08-30 |
| 7994433 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai +3 more | 2011-08-09 |
| 7916492 | Multilayered printed circuit board | Hui Zhong, Kenichi Shimada, Motoo Asai, Dongdong Wang, Koji Sekine +1 more | 2011-03-29 |
| 7910836 | Multilayered printed circuit board, solder resist composition, and semiconductor device | Hui Zhong, Kenichi Shimada, Motoo Asai, Dongdong Wang, Koji Sekine +1 more | 2011-03-22 |