Issued Patents 2011
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8085643 | Optical information reproducing apparatus, optical information recording and reproducing apparatus | — | 2011-12-27 |
| 8030577 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Motoo Asai, Koji Sekine +3 more | 2011-10-04 |
| 8020291 | Method of manufacturing a printed wiring board | Honchin En, Masayuki Hayashi, Dongdong Wang, Motoo Asai, Koji Sekine +3 more | 2011-09-20 |
| 8018045 | Printed circuit board | Honchin En, Masayuki Hayashi, Dongdong Wang, Motoo Asai, Koji Sekine +3 more | 2011-09-13 |
| 8006377 | Method for producing a printed wiring board | Honchin En, Masayuki Hayashi, Dongdong Wang, Motoo Asai, Koji Sekine +3 more | 2011-08-30 |
| 8004950 | Optical pickup, optical information recording and reproducing apparatus and method for optically recording and reproducing information | Tatsuro Ide, Masahiko Takahashi, Takeshi Shimano, Kevin Curtis, Ken E. Anderson | 2011-08-23 |
| 7994433 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Motoo Asai, Koji Sekine +3 more | 2011-08-09 |
| 7990830 | Optical pickup, optical information recording apparatus and optical information recording and reproducing apparatus using the optical pickup | Tatsuro Ide, Kevin Curtis, Ken E. Anderson | 2011-08-02 |
| 7916492 | Multilayered printed circuit board | Hui Zhong, Yukihiko Toyoda, Motoo Asai, Dongdong Wang, Koji Sekine +1 more | 2011-03-29 |
| 7910836 | Multilayered printed circuit board, solder resist composition, and semiconductor device | Hui Zhong, Yukihiko Toyoda, Motoo Asai, Dongdong Wang, Koji Sekine +1 more | 2011-03-22 |