Issued Patents 2011
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076782 | Substrate for mounting IC chip | Hiroaki Kodama, Toyoaki Tanaka | 2011-12-13 |
| 8030577 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Koji Sekine +3 more | 2011-10-04 |
| 8021748 | Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same | Kouta Noda, Yasushi Inagaki | 2011-09-20 |
| 8020291 | Method of manufacturing a printed wiring board | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Koji Sekine +3 more | 2011-09-20 |
| 8018045 | Printed circuit board | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Koji Sekine +3 more | 2011-09-13 |
| 8006377 | Method for producing a printed wiring board | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Koji Sekine +3 more | 2011-08-30 |
| 7994433 | Printed wiring board and method for producing the same | Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Koji Sekine +3 more | 2011-08-09 |
| 7995352 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2011-08-09 |
| 7995880 | Optical path converting member, multilayer print circuit board, and device for optical communication | Hiroaki Kodama, Kazuhito Yamada | 2011-08-09 |
| 7985930 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board | Dongdong Wang, Takahiro Mori | 2011-07-26 |
| 7978478 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2011-07-12 |
| 7916492 | Multilayered printed circuit board | Hui Zhong, Kenichi Shimada, Yukihiko Toyoda, Dongdong Wang, Koji Sekine +1 more | 2011-03-29 |
| 7910836 | Multilayered printed circuit board, solder resist composition, and semiconductor device | Hui Zhong, Kenichi Shimada, Yukihiko Toyoda, Dongdong Wang, Koji Sekine +1 more | 2011-03-22 |
| 7907801 | Optical element, package substrate and device for optical communication | Hiroaki Kodama | 2011-03-15 |
| 7881069 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2011-02-01 |
| 7864543 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2011-01-04 |
| 7864542 | Printed circuit board | Yasushi Inagaki, Dongdong Wang, Hideo Yabashi, Seiji Shirai | 2011-01-04 |