Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049338 | Power semiconductor module and fabrication method | Eladio Clemente Delgado, Richard Alfred Beaupre, Stephen Daley Arthur, Ernest Wayne Balch, Paul Alan McConnelee +1 more | 2011-11-01 |
| 8008125 | System and method for stacked die embedded chip build-up | Paul Alan McConnelee, Donald Paul Cunningham | 2011-08-30 |
| 8008781 | Apparatus and method for reducing pitch in an integrated circuit | Raymond Albert Fillion, Richard Joseph Saia, Paul Alan McConnelee | 2011-08-30 |
| 7964974 | Electronic chip package with reduced contact pad pitch | Raymond Albert Fillion, Richard Joseph Saia, Paul Alan McConnelee | 2011-06-21 |
| 7956457 | System and apparatus for venting electronic packages and method of making same | Raymond Albert Fillion, Elizabeth Ann Burke, Thomas Bert Gorczyca, Charles G. Woychik | 2011-06-07 |
| 7952196 | Affordable high performance high frequency multichip module fabrication and apparatus | Joseph Alfred Iannotti, Christopher James Kapusta | 2011-05-31 |
| 7952187 | System and method of forming a wafer scale package | Christopher James Kapusta, Donald Paul Cunningham, Richard Joseph Saia, Joseph Alfred Iannotti, William Hawkins | 2011-05-31 |
| 7919714 | System and a method for controlling flow of solder | Arun Virupaksha Gowda, James Wilson Rose, Paul Jeffrey Gillespie, Richard Alfred Beaupre, David Richard Esler | 2011-04-05 |