Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7952187 | System and method of forming a wafer scale package | Christopher James Kapusta, Donald Paul Cunningham, Richard Joseph Saia, Kevin Matthew Durocher, William Hawkins | 2011-05-31 |
| 7952196 | Affordable high performance high frequency multichip module fabrication and apparatus | Kevin Matthew Durocher, Christopher James Kapusta | 2011-05-31 |