Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008125 | System and method for stacked die embedded chip build-up | Paul Alan McConnelee, Kevin Matthew Durocher | 2011-08-30 |
| 7952187 | System and method of forming a wafer scale package | Christopher James Kapusta, Richard Joseph Saia, Kevin Matthew Durocher, Joseph Alfred Iannotti, William Hawkins | 2011-05-31 |