YL

Yung-Wei Lai

FT Foxconn Advanced Technology: 1 patents #9 of 34Top 30%
FC Fukui Precision Component (Shenzhen) Co.: 1 patents #12 of 27Top 45%
ZC Zhen Ding Technology Co.: 1 patents #6 of 22Top 30%
Overall (2011): #55,434 of 364,097Top 20%
2
Patents 2011

Issued Patents 2011

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8052881 Method of manufacturing multilayer printed circuit board having buried holes Yun Zhu, Shing-Tza Liou 2011-11-08
7985482 Stiffener sheet and flexible printed circuit board using the same Cheng-Wei Kuo, Shing-Tza Liou 2011-07-26