Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8052881 | Method of manufacturing multilayer printed circuit board having buried holes | Yung-Wei Lai, Shing-Tza Liou | 2011-11-08 |
| 7987586 | Method for manufacturing printed circuit board having different thicknesses in different areas | Dong He, Ming Wang, Wen-Chin Lee | 2011-08-02 |